Key Features & Advantages
Superior 4kV Isolation: Tested at AC 4000V 1mA for 60s, ensuring the highest level of safety for sensitive circuits and operators.
Encapsulated Potting Process: The V2.0 upgrade includes a specialized epoxy resin potting process, providing excellent moisture resistance, vibration protection, and enhanced dielectric strength.
Triple Insulated Wire (TIW): All windings (N1-N6) utilize high-quality triple-insulated wires to guarantee reliable performance under high-voltage stress.
High-Precision Toroidal Core: Built with a P47 CUT23*11 magnetic ring for high efficiency and minimal electromagnetic interference (EMI).
Compact Low-Profile Design: With a maximum height of only 15mm, it is perfect for space-constrained PCB layouts.
Low Parasitic Parameters: Features a low distributed capacitance (10pF Max) and low leakage inductance (1uH Max) for high-speed signal clarity.
Technical Specifications
Item | Specification | Test Conditions
Model | CL1131 (V2.0)
Inductance (1-2) | 15uH Min | 10KHz, 1V
Turns Ratio | 4:7:7:5:7:5 | (1-2:3-4:5-6:6-7:8-9:9-10)
Leakage Inductance | 1uH Max | 10KHz, 1V (Pins 5-10 Shorted)
Capacitance (1-5) | 10pF Max | 10KHz, 1V
HI-POT (Isolation) | AC 4000V | 1mA, 60s
Operating Temp | -10°C to +85°C
Dimensions | Max Height: 15mm; Diameter: 40mm
Material List (BOM)
Core: P47 High-Grade Toroidal Core
Wire: 0.3mm & 0.5mm Triple Insulated Wire (TIW)
Potting Compound: 6020H-4 High-Dielectric Epoxy Resin
Lead-Free: RoHS compliant (Pb-free)
Applications
Industrial Automation Control Boards
Medical Equipment Power & Signal Isolation
Power Line Communication (PLC) Modules
Smart Grid and Metering Devices
High-End Telecommunication Systems